The Silicon Nitride Ceramic Substrate Sintering Furnace features high stability, high user-friendliness, and low maintenance characteristics, employing non-contact high-temperature measurement, vacuum system filtration protection, and a unique exhaust treatment design. It is primarily used for vacuum, degassing, and pressure densification of advanced materials such as silicon nitride cast substrates, and is widely applied in fields such as aerospace, aviation, and electronic electrical semiconductors.

Product Introduction

The Silicon Nitride Ceramic Substrate Sintering Furnace high stability, high user-friendliness, and low maintenance characteristics, employing non-contact high-temperature measurement, vacuum system filtration protection, and a unique exhaust treatment design. It is primarily used for vacuum, degassing, and pressure densification of advanced materials such as silicon nitride cast substrates, and is widely applied in fields such as aerospace, aviation, and electronic electrical semiconductors.

Product parameters
Loading space (W*H*L) 600*600*1400mm (Customizable)
Uniformity of temperature ≤±4 °C
Maximum working temperature 2200 °C
Maximum work pressure 2 MPa
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